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 BCP 54, BCP 55, BCP 56 NPN
General Purpose Transistors NPN
Surface mount Si-Epitaxial PlanarTransistors Si-Epitaxial PlanarTransistoren fur die Oberflachenmontage Power dissipation - Verlustleistung
1.65
4
0.2 0.3
6.5 0.1 3
0.2
1.3 W SOT-223 0.04 g
Plastic case Kunststoffgehause
3.5
Weight approx. - Gewicht ca. Plastic material has UL classification 94V-0 Gehausematerial UL94V-0 klassifiziert Standard packaging taped and reeled Standard Lieferform gegurtet auf Rolle
1
0.7 2.3
2
3
3.25
Dimensions / Mae in mm 1 = B 2, 4 = C 3 = E
Maximum ratings (TA = 25/C) BCP 54 Collector-Emitter-voltage Collector-Base-voltage Emitter-Base-voltage Power dissipation - Verlustleistung Collector current - Kollektorstrom (DC) Peak Collector current - Koll.-Spitzenstrom Peak Base current - Basis-Spitzenstrom Junction temp. - Sperrschichttemperatur Storage temperature - Lagerungstemperatur B open E open C open VCE0 VCB0 VEB0 Ptot IC ICM IBM Tj TS 45 V 45 V
7
Grenzwerte (TA = 25/C) BCP 55 60 V 60 V 5V 1.3 W 1) 1A 1.5 A 200 mA 150/C - 65...+ 150/C BCP 56 80 V 100 V
Characteristics (Tj = 25/C) Min. Collector-Base cutoff current - Kollektorreststrom IE = 0, VCB = 30 V IE = 0, VCB = 30 V, Tj = 125/C Emitter-Base cutoff current - Emitterreststrom IC = 0, VEB = 5 V IC = 500 mA, IB = 50 mA IEB0 VCEsat - - ICB0 ICB0 - -
Kennwerte (Tj = 25/C) Typ. - - - - Max. 100 nA 10 :A 100 nA 500 mV
Collector saturation volt. - Kollektor-Sattigungsspg. 2)
1
) Mounted on P.C. board with 3 mm2 copper pad at each terminal Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lotpad) an jedem Anschlu 2 ) Tested with pulses tp = 300 :s, duty cycle # 2% - Gemessen mit Impulsen tp = 300 :s, Schaltverhaltnis # 2% 26 01.11.2003
General Purpose Transistors Characteristics (Tj = 25/C)
BCP 54, BCP 55, BCP 56 Kennwerte (Tj = 25/C) Min. Typ. - - - - - - 130 MHz - Max. 100 160 250 - - 1V - 1.6
DC current gain - Kollektor-Basis-Stromverhaltnis 1) BCP 5x-6 VCE = 2 V, IC = 150 mA VCE = 2 V, IC = 5 mA VCE = 2 V, IC = 500 mA VCE = 2 V, IC = 500 mA Gain-Bandwidth Product - Transitfrequenz VCE = 5 V, IC = 10 mA, f = 100 MHz DC current gain ratio of the complement. pairs Verhaltnis der Stromverst. complement. Paare Thermal resistance - Warmewiderstand junction to ambient air - Sperrschicht zu umgebender Luft junction to soldering point - Sperrschicht zu Lotpad Recommended complementary PNP transistors Empfohlene komplementare PNP-Transistoren RthA RthS 95 K/W 2) 14 K/W fT hFE1'hFE2 - - BCP 5x-10 BCP 5x-16 hFE hFE hFE 40 63 100 63 40 -
hFE BCP 54... BCP56 hFE VBEon
Base-Emitter voltage - Basis-Emitter-Spannung 1)
BCP 51, BCP 52, BCP 53
) Tested with pulses tp = 300 :s, duty cycle # 2% - Gemessen mit Impulsen tp = 300 :s, Schaltverhaltnis # 2% ) Mounted on P.C. board with 3 mm2 copper pad at each terminal Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lotpad) an jedem Anschlu 01.11.2003
1 2
27


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